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FPGA芯片架构设计与实现

FPGA芯片架构设计与实现目录信息

第1 章 FPGA 架构总体设计 ········································································· 1

1.1 FPGA 芯片研制流程·········································································· 1

1.2 FPGA 架构设计流程·········································································· 7

1.3 FPGA 规模和资源划分 ····································································· 17

1.4 FPGA 中功能模块划分 ····································································· 20

本章参考文献 ······················································································ 26

第2 章 FPGA 中时钟网络 ·········································································· 30

2.1 简介 ···························································································· 30

2.2 FPGA CDN 建模 ············································································· 33

2.3 时钟网络设计方法 ·········································································· 43

2.4 时钟网络的灵活性 ·········································································· 48

2.5 路由级联 ······················································································ 51

2.6 仿真实验 ······················································································ 55

2.7 时钟网络热学建模 ·········································································· 61

2.8 仿真实验 ······················································································ 62

本章参考文献 ······················································································ 66

第3 章 FPGA 中电源/地线网络和漏电流 ······················································· 68

3.1 电源/地线网络 ··············································································· 68

3.2 IR-DROP 分析与优化 ········································································ 71

3.3 漏电流组成 ··················································································· 73

3.4 降低漏电流的方法 ·········································································· 74

3.5 基于VIA 分布的IR-DROP 分析 ··························································· 77

3.6 仿真实验 ······················································································ 81

3.7 不均匀测试点的IR-DROP 求解 ··························································· 87

3.8 FPGA 电源网络IR-DROP 分析 ···························································· 89

本章参考文献 ······················································································ 94

第4 章 FPGA 中可编程逻辑单元 ································································· 98

4.1 基于多路选择器的逻辑单元 ······························································ 98

4.2 基于四输入LUT 的可编程逻辑单元的设计 ·········································· 102

4.3 LUT 的模型与实现 ········································································ 103

4.4 LUT 的输入数目K 的确定 ······························································· 106

4.5 进位逻辑 ····················································································· 109

4.6 基于查找表结构的FPGA 的不足 ······················································· 115

4.7 AIC 结构逻辑簇 ············································································ 117

4.8 基于AIC 结构FPGA 的逻辑簇 ························································· 120

4.9 面向AIC 的映射工具及结构评估平台 ················································ 124

4.10 结构特征匹配的AIC 簇互连优化 ···················································· 125

4.11 仿真分析和比较 ·········································································· 131

本章参考文献 ····················································································· 133

第5 章 FPGA 中可编程I/O 模块 ································································· 136

5.1 可编程I/O 系统结构 ······································································ 136

5.2 IOE 中的可编程输入缓冲器设计 ······················································· 138

5.3 IOE 中的可编程输出缓冲器设计 ······················································· 144

5.4 可编程I/O 的后端版图设计······························································ 156

5.5 高可靠I/O 模块的后端版图与测试 ····················································· 166

5.6 可编程I/O 的供电策略 ··································································· 172

5.7 全芯片IO 的ESD 技术 ··································································· 173

本章参考文献 ····················································································· 179

第6 章 FPGA 中DDR 存储器接口 ······························································ 182

6.1 DDR SDRAM 芯片的工作原理 ·························································· 182

6.2 FPGA 芯片中DDR 存储器接口系统设计 ············································· 184

6.3 DDR 存储器接口控制器的设计和验证 ················································ 191

6.4 延时锁相技术 ··············································································· 194

6.5 延时锁定环电路的分析与对比 ·························································· 196

6.6 数字延时锁定环电路的性能分析与优化 ·············································· 201

6.7 延时锁定环线性模型与稳定性分析 ···················································· 205

本章参考文献 ····················································································· 209

第7 章 FPGA 中数字延时锁定环 ································································ 213

7.1 实现相移的全数字延迟锁定环 ·························································· 213

7.2 数字控制延时链 ············································································ 215

7.3 时间数字转换器 ············································································ 220

7.4 双向移位计数器 ············································································ 221

7.5 鉴相器与锁定逻辑 ········································································· 222

7.6 延迟锁定环的版图设计 ··································································· 224

7.7 延迟锁定环环路的仿真 ··································································· 224

7.8 芯片的物理实现与测试平台 ····························································· 225

7.9 DDR 接口的数据通路的测试验证 ······················································ 227

7.10 数字延时锁定环的测试 ································································· 229

7.11 数字占空比矫正电路的测试 ···························································· 232

本章参考文献 ····················································································· 234

第8 章 FPGA 中连线连接盒 ······································································ 236

8.1 引言 ··························································································· 236

8.2 问题分析 ····················································································· 237

8.3 利用模拟退火算法优化CB 拓扑结构 ·················································· 241

8.4 实验及结果分析 ············································································ 246

8.5 连线开关盒的电路结构设计方法 ······················································· 251

本章参考文献 ····················································································· 259

第9 章 FPGA 中互连线段长度分布 ····························································· 261

9.1 所提优化方法的基本思路 ································································ 261

9.2 以面积延时积最小为目标的优化 ······················································· 265

9.3 针对所提优化方法的讨论 ································································ 268

9.4 设计实验 ····················································································· 269

9.5 FPGA 芯片的设计实现 ···································································· 270

9.6 芯片的测试准备 ············································································ 272

本章参考文献 ····················································································· 275

第10 章 FPGA 中的配置模块 ···································································· 277

10.1 配置系统的基本组成及特点 ···························································· 277

10.2 配置系统的功能需求 ···································································· 279

10.3 配置系统的硬件结构分析 ······························································ 281

10.4 配置码流协议的结构及其对配置系统的影响 ······································· 286

10.5 配置系统总体框架 ······································································· 292

10.6 配置码流协议的设计 ···································································· 297

10.7 配置系统的电路设计与实现 ···························································· 300

10.8 配置系统采用的验证工具与方法 ······················································ 305

10.9 配置系统的验证方案与功能点的抽取 ················································ 310

10.10 配置系统功能验证平台的设计 ······················································· 312

10.11 配置系统验证结果 ······································································ 319

本章参考文献 ····················································································· 324

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FPGA芯片架构设计与实现造价信息

  • 市场价
  • 信息价
  • 询价

杠铃片架

  • 3.0厚
  • 达创
  • 13%
  • 河北达创体育器材有限公司
  • 2022-12-06
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杠铃片架

  • 3.0mm
  • 达创
  • 13%
  • 河北达创体育器材有限公司
  • 2022-12-06
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杠铃片架

  • 61cm×58cm×124cm
  • 39
  • 13%
  • 河北达创体育器材有限公司
  • 2022-12-06
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芯片

  • CA-EI-C品种:ID卡;
  • 霍尼韦尔
  • 13%
  • 石家庄冠旭商贸有限公司
  • 2022-12-06
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芯片

  • CA-MS-C品种:系统调试卡;型号:Mifare-1;
  • 霍尼韦尔
  • 13%
  • 石家庄冠旭商贸有限公司
  • 2022-12-06
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自动洗

  • 台班
  • 韶关市2010年8月信息价
  • 建筑工程
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X光脱水烘干机

  • ZTH-340
  • 台班
  • 韶关市2010年8月信息价
  • 建筑工程
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弯管机(带胎压机)

  • WC27-108
  • 台班
  • 汕头市2011年3季度信息价
  • 建筑工程
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弯管机(带胎压机)

  • WC27-108
  • 台班
  • 汕头市2011年2季度信息价
  • 建筑工程
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弯管机(带胎压机)

  • WC27-108
  • 台班
  • 广州市2011年1季度信息价
  • 建筑工程
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系统芯片

  • :(Vcc/Vdd)1.81V - 2V数据转换器A/D: 16x12b振荡器类型:内部工作温度:-40°C - 125°C(TA)
  • 20个
  • 1
  • 中档
  • 含税费 | 含运费
  • 2022-08-09
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RFID芯片

  • 工作频率:915±45MHz
  • 10600个
  • 1
  • 中档
  • 不含税费 | 含运费
  • 2018-08-21
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信息芯片

  • DS1990A-F5
  • 5926台
  • 1
  • DALLAS
  • 普通
  • 含税费 | 含运费
  • 2015-07-15
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DSP芯片

  • 1、DSP资源扩展卡2、含2个DSP芯片3、处理芯片运算能力不劣于800MHz
  • 1块
  • 1
  • 中档
  • 不含税费 | 不含运费
  • 2020-05-11
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MI高频芯片房卡

  • 1.名称:MI高频芯片房卡2.参数:M1高频芯片卡,房卡智能化使用第十扇区
  • 1000张
  • 1
  • 肯天智能;深圳
  • 中高档
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FPGA芯片架构设计与实现基本信息

作 译 者:余乐,谢元禄

出版时间:2017-07 千 字 数:550

版 次:01-01 页 数:344

开 本:16开

I S B N :9787121306105

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FPGA芯片架构设计与实现常见问题

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柜面量化考核系统三层架构设计与实现 柜面量化考核系统三层架构设计与实现

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杜勇,四川省广安市人,高级工程师。1999年于湖南大学获电子工程专业学士学位,2005年于国防科技大学获信息与通信工程专业硕士学位。主要从事数字信号处理、无线通信以及FPGA应用技术研究。发表学术论文十余篇,出版《数字滤波器的MATLAB与FPGA实现(第2版)》、《数字通信同步技术的MATLAB与FPGA实现》、《数字调制解调技术的MATLAB与FPGA实现》等多部著作。

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本书从工程应用的角度详细阐述锁相环技术的工作原理,利用MATLAB及System View仿真工具软件讨论典型电路的工作过程。以Altera公司的FPGA为开发平台,以Verilog HDL语言为开发工具,详细阐述锁相环技术的FPGA实现原理、结构、方法,以及仿真测试过程和具体技术细节,主要包括设计平台及开发环境介绍、锁相环跟踪相位的原理、FPGA实现数字信号处理基础、锁相环路模型、一阶环路的FPGA实现、环路滤波器与锁相环特性、二阶环路的FPGA实现、锁相环路性能分析、锁相测速测距的FPGA实现 。

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数字滤波器的MATLAB与FPGA实现——Altera/Verilog版内容简介

本书以Altera公司的FPGA器件为开发平台,采用MATLAB及Verilog HDL语言开发工具,详细阐述了数字滤波器的实现原理、结构、方法及仿真测试过程,并通过大量工程实例分析其在FPGA实现过程中的具体技术细节。其主要内容包括FIR滤波器、IIR滤波器、多速率滤波器、自适应滤波器、变换域滤波器、解调系统的滤波器设计等。本书思路清晰、语言流畅、分析透彻,在简明阐述设计原理的基础上,追求对工程实践的指导性,力求使读者在较短的时间内掌握数字滤波器的FPGA设计知识和技能。

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