一、综合词汇

1、印制电路：printedcircuit2、印制线路：printedwiring3、印制板：printedboard4、印制板电路：printedcircuitboard(PCB)5、印制线路板：printedwiringboard(PwB)6、印制元件：printedcomponent7、印制接点：printedcontact8、印制板装配：printedboardassembly9、板：board10、单面印制板：single-sidedprintedboard(SSB)11、双面印制板：double-sidedprintedboard(DSB)12、多层印制板：mulitlayerprintedboard(MLB)13、多层印制电路板：mulitlayerprintedcircuitboard14、多层印制线路板：mulitlayerpritedwiringboard15、刚性印制板：rigidprintedboard16、刚性单面印制板：rigidsingle-sidedprintedborad17、刚性双面印制板：rigiddouble-sidedprintedborad18、刚性多层印制板：rigidmultilayerprintedboard19、挠性多层印制板：flexiblemultilayerprintedboard20、挠性印制板：flexibleprintedboard21、挠性单面印制板：flexiblesingle-sidedprintedboard22、挠性双面印制板：flexibledouble-sidedprintedboard23、挠性印制电路：flexibleprintedcircuit(FPC)24、挠性印制线路：flexibleprintedwiring25、刚性印制板：flex-rigidprintedboard,rigid-flexprintedboard26、刚性双面印制板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted27、刚性多层印制板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard28、齐平印制板：flushprintedboard29、金属芯印制板：metalcoreprintedboard30、金属基印制板：metalbaseprintedboard31、多重布线印制板：mulit-wiringprintedboard32、陶瓷印制板：ceramicsubstrateprintedboard33、导电胶印制板：electroconductivepasteprintedboard34、模塑电路板：moldedcircuitboard35、模压印制板：stampedprintedwiringboard36、顺序层压多层印制板：sequentially-laminatedmulitlayer37、散线印制板：discretewiringboard38、微线印制板：microwireboard39、积层印制板：buile-upprintedboard40、积层多层印制板：build-upmulitlayerprintedboard(BUM)41、积层挠印制板：build-upflexibleprintedboard42、表面层合电路板：surfacelaminarcircuit(SLC)43、埋入凸块连印制板：B2itprintedboard44、多层膜基板：multi-layeredfilmsubstrate(MFS)45、层间全内导通多层印制板：ALIVHmultilayerprintedboard46、载芯片板：chiponboard(COB)47、埋电阻板：buriedresistanceboard48、母板：motherboard49、子板：daughterboard50、背板：backplane51、裸板：bareboard52、键盘板夹心板：copper-Invar-copperboard53、动态挠性板：dynamicflexboard54、静态挠性板：staticflexboard55、可断拼板：break-awayplanel56、电缆：cable57、挠性扁平电缆：flexibleflatcable(FFC)58、薄膜开关：membraneswitch59、混合电路：hybridcircuit60、厚膜：thickfilm61、厚膜电路：thickfilmcircuit62、薄膜：thinfilm63、薄膜混合电路：thinfilmhybridcircuit64、互连：interconnection65、导线：conductortraceline66、齐平导线：flushconductor67、传输线：transmissionline68、跨交：crossover69、板边插头：edge-boardcontact70、增强板：stiffener71、基底：substrate72、基板面：realestate73、导线面：conductorside74、元件面：componentside75、焊接面：solderside76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductivepattern80、非导电图形：non-conductivepattern81、字符：legend82、标志：mark

二、基材：

1、基材：basematerial2、层压板：laminate3、覆金属箔基材：metal-cladbadematerial4、覆铜箔层压板：copper-cladlaminate(CCL)5、单面覆铜箔层压板：single-sidedcopper-cladlaminate6、双面覆铜箔层压板：double-sidedcopper-cladlaminate7、复合层压板：compositelaminate8、薄层压板：thinlaminate9、金属芯覆铜箔层压板：metalcorecopper-cladlaminate10、金属基覆铜层压板：metalbasecopper-cladlaminate11、挠性覆铜箔绝缘薄膜：flexiblecopper-claddielectricfilm12、基体材料：basismaterial13、预浸材料：prepreg14、粘结片：bondingsheet15、预浸粘结片：preimpregnatedbondingsheer16、环氧玻璃基板：epoxyglasssubstrate17、加成法用层压板：laminateforadditiveprocess18、预制内层覆箔板：masslaminationpanel19、内层芯板：corematerial20、催化板材：catalyzedboard,coatedcatalyzedlaminate21、涂胶催化层压板：adhesive-coatedcatalyzedlaminate22、涂胶无催层压板：adhesive-coateduncatalyzedlaminate23、粘结层：bondinglayer24、粘结膜：filmadhesive25、涂胶粘剂绝缘薄膜：adhesivecoateddielectricfilm26、无支撑胶粘剂膜：unsupportedadhesivefilm27、覆盖层：coverlayer(coverlay)28、增强板材：stiffenermaterial29、铜箔面：copper-cladsurface30、去铜箔面：foilremovalsurface31、层压板面：uncladlaminatesurface32、基膜面：basefilmsurface33、胶粘剂面：adhesivefaec34、原始光洁面：platefinish35、粗面：mattfinish36、纵向：lengthwisedirection37、模向：crosswisedirection38、剪切板：cuttosizepanel39、酚醛纸质覆铜箔板：phenoliccellulosepapercopper-cladlaminates(phenolic/paperCCL)40、环氧纸质覆铜箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperCCL)41、环氧玻璃布基覆铜箔板：epoxidewovenglassfabriccopper-cladlaminates42、环氧玻璃布纸复合覆铜箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates44、聚酯玻璃布覆铜箔板：ployesterwovenglassfabriccopper-cladlaminates45、聚酰亚胺玻璃布覆铜箔板：polyimidewovenglassfabriccopper-cladlaminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates47、环氧合成纤维布覆铜箔板：epoxidesyntheticfiberfabriccopper-cladlaminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiberglasscopper-cladlaminates49、超薄型层压板：ultrathinlaminate50、陶瓷基覆铜箔板：ceramicsbasecopper-cladlaminates51、紫外线阻挡型覆铜箔板：UVblockingcopper-cladlaminates

三、基材的材料

1、A阶树脂：A-stageresin2、B阶树脂：B-stageresin3、C阶树脂：C-stageresin4、环氧树脂：epoxyresin5、酚醛树脂：phenolicresin6、聚酯树脂：polyesterresin7、聚酰亚胺树脂：polyimideresin8、双马来酰亚胺三嗪树脂：bismaleimide-triazineresin9、丙烯酸树脂：acrylicresin10、三聚氰胺甲醛树脂：melamineformaldehyderesin11、多官能环氧树脂：polyfunctionalepoxyresin12、溴化环氧树脂：brominatedepoxyresin13、环氧酚醛：epoxynovolac14、氟树脂：fluroresin15、硅树脂：siliconeresin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphouspolymer19、结晶现象：crystallinepolamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosettingresin24、热塑性树脂：thermoplasticresin25、感光性树脂：photosensitiveresin26、环氧当量：weightperepoxyequivalent(WPE)27、环氧值：epoxyvalue28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curingagent32、阻燃剂：flameretardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiatedpolyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimidefilm(PI)38、聚四氟乙烯：polytetrafluoetylene(PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylenecopolymerfilm(FEP)40、增强材料：reinforcingmaterial41、玻璃纤维：glassfiber42、E玻璃纤维：E-glassfibre43、D玻璃纤维：D-glassfibre44、S玻璃纤维：S-glassfibre45、玻璃布：glassfabric46、非织布：non-wovenfabric47、玻璃纤维垫：glassmats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weftyarn52、经纱：warpyarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：threadcount57、织物组织：weavestructure58、平纹组织：plainstructure59、坏布：greyfabric60、稀松织物：wovenscrim61、弓纬：bowofweave62、断经：endmissing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fisheye68、毛圈长：featherlength69、厚薄段：mark70、裂缝：split71、捻度：twistofyarn72、浸润剂含量：sizecontent73、浸润剂残留量：sizeresidue74、处理剂含量：finishlevel75、浸润剂：size76、偶联剂：couplintagent77、处理织物：finishedfabric78、聚酰胺纤维：polyarmidefiber79、聚酯纤维非织布：non-wovenpolyesterfabric80、浸渍绝缘纵纸：impregnatinginsulationpaper81、聚芳酰胺纤维纸：aromaticpolyamidepaper82、断裂长：breakinglength83、吸水高度：heightofcapillaryrise84、湿强度保留率：wetstrengthretention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductivefoil88、铜箔：copperfoil89、电解铜箔：electrodepositedcopperfoil(EDcopperfoil)90、压延铜箔：rolledcopperfoil91、退火铜箔：annealedcopperfoil92、压延退火铜箔：rolledannealedcopperfoil(RAcopperfoil)93、薄铜箔：thincopperfoil94、涂胶铜箔：adhesivecoatedfoil95、涂胶脂铜箔：resincoatedcopperfoil(RCC)96、复合金属箔：compositemetallicmaterial97、载体箔：carrierfoil98、殷瓦：invar99、箔（剖面）轮廓：foilprofile100、光面：shinyside101、粗糙面：matteside102、处理面：treatedside103、防锈处理：stainproofing104、双面处理铜箔：doubletreatedfoil

四、设计

1、原理图：shematicdiagram2、逻辑图：logicdiagram3、印制线路布设：printedwirelayout4、布设总图：masterdrawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aideddesign.(CAD)7、计算机辅助制造：computer-aidedmanufacturing.(CAM)8、计算机集成制造：computerintegratmanufacturing.(CIM)9、计算机辅助工程：computer-aidedengineering.(CAE)10、计算机辅助测试：computer-aidedtest.(CAT)11、电子设计自动化：electricdesignautomation.(EDA)12、工程设计自动化：engineeringdesignautomaton.(EDA2)13、组装设计自动化：assemblyaidedarchitecturaldesign.(AAAD)14、计算机辅助制图：computeraideddrawing15、计算机控制显示：computercontrolleddisplay.(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logicsimulation22、电路模拟：circitsimulation23、时序模拟：timingsimulation24、模块化：modularization25、布线完成率：layouteffeciency26、机器描述格式：machinedescriptionmformat.(MDF)27、机器描述格式数据库：MDFdatabse28、设计数据库：designdatabase29、设计原点：designorigin30、优化（设计）：optimization(design)31、供设计优化坐标轴：predominantaxis32、表格原点：tableorigin33、镜像：mirroring34、驱动文件：drivefile35、中间文件：intermediatefile36、制造文件：manufacturingdocumentation37、队列支撑数据库：queuesupportdatabase38、元件安置：componentpositioning39、图形显示：graphicsdispaly40、比例因子：scalingfactor41、扫描填充：scanfilling42、矩形填充：rectanglefilling43、填充域：regionfilling44、实体设计：physicaldesign45、逻辑设计：logicdesign46、逻辑电路：logiccircuit47、层次设计：hierarchicaldesign48、自顶向下设计：top-downdesign49、自底向上设计：bottom-updesign50、线网：net51、数字化：digitzing52、设计规则检查：designrulechecking53、走（布）线器：router(CAD)54、网络表：netlist55、计算机辅助电路分析：computer-aidedcircuitanalysis56、子线网：subnet57、目标函数：objectivefunction58、设计后处理：postdesignprocessing(PDP)59、交互式制图设计：interactivedrawingdesign60、费用矩阵：costmetrix61、工程图：engineeringdrawing62、方块框图：blockdiagram63、迷宫：moze64、元件密度：componentdensity65、巡回售货员问题：travelingsalesmanproblem66、自由度：degreesfreedom67、入度：outgoingdegree68、出度：incomingdegree69、曼哈顿距离：manhattondistance70、欧几里德距离：euclideandistance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logicdesignautomation76、分线：separatedtime77、分层：separatedlayer78、定顺序：definitesequence

五、形状与尺寸：

1、导线（通道）：conduction(track)2、导线（体）宽度：conductorwidth3、导线距离：conductorspacing4、导线层：conductorlayer5、导线宽度/间距：conductorline/space6、第一导线层：conductorlayerNo.17、圆形盘：roundpad8、方形盘：squarepad9、菱形盘：diamondpad10、长方形焊盘：oblongpad11、子弹形盘：bulletpad12、泪滴盘：teardroppad13、雪人盘：snowmanpad14、V形盘：V-shapedpad15、环形盘：annularpad16、非圆形盘：non-circularpad17、隔离盘：isolationpad18、非功能连接盘：monfunctionalpad19、偏置连接盘：offsetland20、腹（背）裸盘：back-bardland21、盘址：anchoringspaur22、连接盘图形：landpattern23、连接盘网格阵列：landgridarray24、孔环：annularring25、元件孔：componenthole26、安装孔：mountinghole27、支撑孔：supportedhole28、非支撑孔：unsupportedhole29、导通孔：via30、镀通孔：platedthroughhole(PTH)31、余隙孔：accesshole32、盲孔：blindvia(hole)33、埋孔：buriedviahole34、埋/盲孔：buried/blindvia35、任意层内部导通孔：anylayerinnerviahole(ALIVH)36、全部钻孔：alldrilledhole37、定位孔：toalinghole38、无连接盘孔：landlesshole39、中间孔：interstitialhole40、无连接盘导通孔：landlessviahole41、引导孔：pilothole42、端接全隙孔：terminalclearomeehole43、准表面间镀覆孔：quasi-interfacingplated-throughhole44、准尺寸孔：dimensionedhole45、在连接盘中导通孔：via-in-pad46、孔位：holelocation47、孔密度：holedensity48、孔图：holepattern49、钻孔图：drilldrawing50、装配图：assemblydrawing51、印制板组装图：printedboardassemblydrawing52、参考基准：datumreference2100433B