1. Guofeng Cui*, Ning Li, Deyu Li, Minglei Chi. Study of Optimized Complexing Agent for Low-Phosphorus Electroless Nickel Plating Bath. Journal of The Electrochemical Society. 2005, 152(10): C669-C674.
2. Guofeng Cui*, Ning Li, Jianwei Zhao, Mingbo Zhang. Ab initio MO Study on the Reaction Mechanism of Reduction of Hypophosphorous Acid. Journal of The Electrochemical Society. 2005, 152(12): C861-C864.
3. Guofeng Cui*, Jinghe Wang, Ning Li, Xingqiao Huang. A Single Precursor Pit for Pitting Corrosion on Defect of Tinplate Alloy Layer Visualized by Atomic Force Microscopy. Materials Chemistry & Physics. 2005, 97(1): 488-493.
4. Guofeng Cui*, Ning Li, Deyu Li, Jian Zheng, Qinglong Wu. The Physical and Electrochemical Properties of Electroless Deposited Black Nickel–Phosphorus Alloys. Surface and Coatings Technology. 2006, 200(24): 6808-6814.
5. Jie Zhao, Ning Li, Guofeng Cui*, Jian Weizhao. Study on Immersion Tin Process by Electrochemical Methods and Molecular Orbital Theory. Journal of The Electrochemical Society. 2006, 153(12): C848-C853.
6. Jie Zhao, Ning Li, Shan Gao, Guofeng Cui. The Irreversible Characteristic Analysis of Thiourea on Copper Electrodes in Aqueous 0.5 mol/L Sulphuric Acid. Electrochemistry Communications. 2007, 9(9): 2261-2265.
7. Gang Wu, Raja Swaidan, Guofeng Cui. Electrooxidations of ethanol, acetaldehyde and acetic acid using PtRuSn/C catalysts prepared by modified alcohol-reduction process. Journal of Power Sources . 2007, 172(1): 180-188.
8. Guofeng Cui*, Hong Liu, Gang Wu, Jianwei Zhao, Shuqing Song, Peikang Shen. Electrochemical Impedance Spectroscopy and First-Principle Investigations on the Oxidation Mechanism of Hypophosphite Anion in the Electroless Deposition System of Nickel. The Journal of Physical Chemistry C. 2008, 112(12): 4601-4607.
9.吴懿平. 金锡合金焊料的性能. 环球SMT与封装. 2008. 7-8. 8-10.周涛, 汤姆·鲍勃, 马丁·奥德, 贾松良. 金锡焊料及其在电子器件封装领域中的应用. 电子与封装. 2005. 5(8). 5-8.
10. W. Sun, D.G. Ivey. Microstructural Study of Co-electroplated Au/Sn Alloys. J. Electron. Mater.2001. 36(3). 757-766.
11.B. Djurfors, D.G. Ivey. Pulsed Electrodeposition of the Eutectic Au/Sn Solder for Optoelectronic Packaging. J. Electron. Mater.2001. 30(9). 1249-1254
12. 张福顺, 黄明亮, 潘剑灵, 王来. 无氰金-锡合金电镀液的成分优化及电流密度确定. 机械工程材料.
2010. 34(11). 50-54.
13. 卿相勇, 黄明亮(指导教师). 无氰共沉积电镀Au-Sn凸点的研究. 大连:大连理工大学硕士论文. 2010.6.
14.刘欣, 胡立雪, 罗驰. 电化学制备金锡合金薄膜技术研究. 微电子学. 2010. 40(3). 430-433.
15. 张静, 徐会武, 李学颜, 苏明敏, 陈国鹰. 电镀Au-Sn合金的研究. 半导体技术.2009. 34(11). 1066-1069.
